Industry News
DNP | Development of a New Generation of Interposer for Semiconductor Packaging
CINNO Research, Dainippon Printing Co., Ltd. recently announced that it has developed a new generation
08/12/2021
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Industry News
Introduction of MOF materials
Recently, the new material MOF developed by Japan has attracted worldwide attention. This article explains
04/11/2021
Fujifilm: 4 billion investment in semiconductor materials, target 10% EUV photoresist market share
With the surge in global demand for 5G and AI chips, Fujifilm Holdings will invest
02/09/2021