Introduction to cationic light curing of monomers
Introduction to cationic light-curing monomers Cationic photopolymerization mechanism Anaerobic polymerization resistance Less human irritation from epoxy monomer Less volume shrinkage
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8kg Tris(2-pyridylmethyl)amine [16858-01-8] in stock now
8kg Tris(2-pyridylmethyl)amine [16858-01-8] in stock now We had just finished about 8kg Tris(2-pyridylmethyl)amine [16858-01-8] and put into storage. Appearance: white
200kg 3,5-Dibromobenzaldehyde [56990-02-4] In Stock Now
200kg 3,5-Dibromobenzaldehyde [56990-02-4] In Stock Now Our company had just finished the production of 200kg 3,5-Dibromobenzaldehyde [56990-02-4] and put into storage.
DNP | Development of a New Generation of Interposer for Semiconductor Packaging
CINNO Research, Dainippon Printing Co., Ltd. recently announced that it has developed a new generation of interposer for semiconductor packaging.
Introduction of MOF materials
Recently, the new material MOF developed by Japan has attracted worldwide attention. This article explains MOF materials from the following
Photoresist: semiconductor high-barrier core material
Photoresist is currently widely used in the processing and production of micro-pattern lines in the optoelectronic information industry. The cost
In-depth interpretation of electronic materials Potting glue
Potting is the mechanical or manual method of pouring the liquid compound into the device equipped with electronic components and
Fujifilm: 4 billion investment in semiconductor materials, target 10% EUV photoresist market share
With the surge in global demand for 5G and AI chips, Fujifilm Holdings will invest US$637 million in its semiconductor
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